Broadcom (AVGO.US) CEO: The next bottleneck for AI is not chips but capital, yet many investors act like gamblers

智通财经2026/10/12 12:06

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According to Golden Ten Data, Broadcom (AVGO.US) President and CEO Hock Tan said on Monday in Singapore that as the industry continues to expand infrastructure spending to support increasingly powerful models, capital—rather than chip supply—will become the biggest constraint on AI development. He also poured cold water on the influx of investors, stating that many of their strategies resemble those of gamblers, with little real understanding of what they are betting on.

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AMD has released the Helion Intelligent Agent AI rack design, based on the Open Compute Project (OCP) standard. The CPU-only configuration supports up to 32,768 CPU cores, while also offering an integrated CPU+GPU enterprise setup. The platform features a built-in token router and supports multi-model scheduling. Eight major hardware manufacturers, including Cisco, Dell, and HPE, have announced their support. Related products are expected to launch in November 2026.

华尔街见闻•2026/10/13 03:53