Qualcomm posts Deutsche Bank 2026 Technology Conference transcript

Reuters2026/08/28 04:17

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Qualcomm transcript from the Deutsche Bank 2026 Technology Conference, featuring EVP and GM Durga Malladi in a fireside chat with analyst Amy Sutter.
Malladi framed high-bandwidth compute (HBC) as a compute-plus-memory co-design to address an AI “memory wall,” positioned as an alternative to HBM.
He cited 6x better tokens-per-watt versus HBM, with bandwidth in the hundreds of terabytes per second; SRAM seen as costly on area and racks.
Gen 1 HBC slated to ship commercially in 2027, Gen 2 in 2028; silicon has returned to labs, with validation data expected next quarter.
He described active hyperscaler talks with mix-and-match adoption of HBC, CPUs, accelerators, or custom silicon; HBC aimed at decode, not prefill.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Qualcomm Inc. published the original content used to generate this news brief on August 28, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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Qualcomm posts Deutsche Bank 2026 Technology Conference transcript

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