SK hynix invests over $4 billion in Indiana HBM packaging plant, output set for 2029

Reuters2026/08/27 16:07

By:Reuters

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SK hynix will invest over $4 billion to build an AI-memory advanced packaging facility in West Lafayette, Indiana.
Cleanroom opening targeted for October 2028; mass production of next-generation HBM slated for H2 2029.
First US HBM production base; wafers made in South Korea will be packaged and tested in Indiana for US customers.
Plan includes an advanced packaging R&D testbed to speed prototyping with customers, universities, partners.
Project outlook calls for about 1,000 on-site staff, 7,000 direct and indirect jobs, more than 100 potential suppliers.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SK Hynix Inc. published the original content used to generate this news brief on August 28, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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SK hynix invests over $4 billion in Indiana HBM packaging plant, output set for 2029

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