LG Chem to showcase advanced packaging materials for AI semiconductors at SEMICON Taiwan 2026
Reuters2026/08/26 10:24- LG Corp. unit LG Chem will attend SEMICON Taiwan 2026 on Sept. 2-4 in Taipei to showcase AI semiconductor packaging materials.
- Exhibit targets advanced packaging for HBM and AI chips, seeking deeper ties with chipmakers, OSATs, substrate, packaging companies.
- Power semiconductor materials for AI data centers will also be shown, including sintering pastes and thermal interface materials.
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