Citrini’s View: Korean Manufacturers Take a Cautious Approach to 3D IC Commercialization, While China’s Changxin Accelerates Entry into Niche Markets Through Customization

BlockBeats News, on July 25, Citrini analyst Jukan cited the latest industry analysis from ZDNet Korea, pointing out that the performance race in AI semiconductors is shifting from process miniaturization to advanced stacking technology. Vertically integrating logic and memory through 3D ICs is becoming the next-generation key technology. Recently, Samsung Foundry has seen a surge in inquiries about 3D ICs, with almost every potential client asking about this technology. However, Jukan believes that 3D ICs are essentially custom-made DRAM, which fundamentally conflicts with the core business model of standardized mass production practiced by Samsung and SK Hynix. The two Korean manufacturers are expected to restrict themselves to preliminary research and remain cautious about full commercialization.

This structural hesitation has opened a window for niche players. Due to U.S. semiconductor restrictions, China-based ChangXin Memory Technologies is struggling to enter the HBM market and is positioning 3D IC technology as its differentiation strategy, targeting custom memory instead of direct competition with Korean manufacturers in the bulk DRAM market. According to officials from the Korean semiconductor industry, China has already led the production of multiple 3D DRAM sample chips, and niche market participants like ChangXin and Winbond Electronics are very likely to establish this market first.

Earlier, analyst Jukan also pointed out that NVIDIA CUDA’s moat is collapsing, as the dismantling of software ecosystem barriers and the customization trend in 3D ICs are happening simultaneously, which may structurally reshuffle the next-generation AI memory competition landscape.

Note: The Niche Market refers to a segment within a larger market that is overlooked or avoided by mainstream players; “niche players” are companies focusing on these specialized fields.