Samsung Electronics plans to build four new semiconductor wafer plants in South Korea by 2030

Odaily reports that South Korean semiconductor company Samsung Electronics is fine-tuning its investment plan for a large-scale semiconductor production base in South Korea, aiming to build four new wafer fabs by 2030, and has already shared the plan with key partners.

Samsung Electronics plans to build Pyeongtaek P5 and P6, as well as one wafer fab at the Namsa-eup semiconductor cluster in Yongin City and a new wafer fab in Gwangju. SK Hynix is expected to build Y1 and Y2 at the Wonsam-myeon semiconductor cluster in Yongin City and to construct a new wafer fab in Gwangju. By 2030, the two companies will have built a total of seven new wafer fabs.

On the 29th of last month, Samsung Electronics and SK Hynix announced a semiconductor equipment investment roadmap with a total amount of 32 trillion won, not including AI data center investment. Samsung Electronics has moved the completion target for the Yongin wafer fab up from 2047 to 2040, while SK Hynix advanced their target from 2045 to 2033.

According to people in the semiconductor equipment industry, Samsung Electronics recently inquired whether partners are interested in additional investment in Gwangju, on the condition that a wafer fab would be built there before 2030. However, considering current production capacity and the infrastructure in Gwangju, the feasibility remains uncertain.