Micron plans to develop stacked GDDR technology, prototype expected to be launched in 2027
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Glonghui, April 1 | According to Sci-Tech Innovation Board Daily, Micron Technology is making its first attempt at developing stacked graphic memory (GDDR) technology. The company is preparing the necessary equipment and plans to begin process testing in the second half of 2026. Stacked GDDR may not match HBM in performance, but it offers greater capacity. Early company designs are expected to use an approximately four-layer stacking structure, with prototype products potentially debuting as early as 2027.
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