Strategy may sell preferred shares to raise $300 million to continue increasing its bitcoin holdings

The U.S. Department of Defense has provided Wolfspeed (WOLF.US), a chip manufacturer, with a conditional senior secured loan commitment of up to $1.5 billions for a 30-year term, to support domestic production of silicon carbide materials and wide bandgap power devices. According to deal terms still under negotiation, Wolfspeed will grant the Department of Defense warrants to purchase up to 7.5% of the company’s shares in stages. Last July, Wolfspeed filed for bankruptcy due to production issues at a key silicon carbide wafer manufacturing plant. The company stated that the funds would be used to expand production of silicon carbide materials and power devices for the telecommunications, aerospace, and defense sectors, and to upgrade material supply capability for military communication systems. Following the announcement, Wolfspeed’s stock price surged over 28% after hours.

According to The Wall Street Journal, sources reveal that Oracle is in talks with institutions such as Apollo and Goldman Sachs for financing to support a large-scale chip purchase. Oracle hopes to complete the deal as early as this year. This financing is intended to bridge the funding gap between Oracle’s payment for hardware procurement and the cloud computing business beginning to generate revenue.

According to The Wall Street Journal, sources say Oracle (ORCL.US) is in talks with institutions such as Apollo and Goldman Sachs for financing to fund a large-scale chip purchase, aiming to complete the deal as soon as this year. This financing is intended to bridge the funding gap between Oracle's hardware purchases and the commencement of revenue generation from its cloud computing business.

According to the Wall Street Journal citing sources, Broadcom (AVGO.US) has been seeking over $50 billion in financing in recent weeks to jointly develop custom AI chips with OpenAI. Institutions such as Apollo and Blackstone have engaged in discussions to participate in the financing, which is still in its early stages and may see the total amount adjusted. The financing aims to cover several gigawatts of custom chip capacity for OpenAI, with completion expected as early as the end of this year. Internally, OpenAI refers to the chip project as "Nexus," with the first and second generation chips codenamed Jalapeño and Serrano, respectively. OpenAI and Broadcom had previously announced plans to jointly develop a 10-gigawatt custom chip system, scheduled for continuous deployment from the second half of 2026 through the end of 2029.