Analyst: BTC and ETH Rise Depends on U.S. Economic Policy's Ability to Curb Dollar Strength
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SemiAnalysis: Flash memory manufacturing is “switching from tungsten to molybdenum”
SemiAnalysis reports that after surpassing 300 layers in 3D NAND flash memory stacking, tungsten word lines have reached their physical limits in terms of resistance, chemical compatibility, and deep hole filling, making molybdenum a mandatory replacement material. Samsung began mass production in 2024, Micron will follow in 2025, and SK Hynix plans to launch 375-layer molybdenum process products by the end of 2026. The molybdenum deposition equipment market is expected to achieve sales of over $1 billion by 2027.
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