Mattr publishes investor presentation outlining critical-infrastructure materials technology strategy

Winbond Electronics has initiated an early expansion plan for Module B at its Lujhu plant in Kaohsiung, with construction expected to begin in 2027 and equipment installation in 2029. Customer capacity negotiations have already been scheduled through 2029 to 2030. The institution believes that AI-driven demand for storage will “continue for quite a long time.” In addition, Winbond has invested approximately 4 billion yuan in the silicon capacitor production line, with mass production expected as early as 2027. This is regarded as a third growth driver beyond logic and storage.